EMIB Technology Development Process Champion
Company: INTEL
Location: Albuquerque
Posted on: April 28, 2024
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Job Description:
Job DescriptionIntel's Advanced Packaging (AP) technologies
extend and drive Moore's Law as the company aspires to a trillion
transistors in a package by 2030. Intel has led the industry in
disaggregated advanced packaging for a couple of decades. Its
innovations include EMIB (embedded multi-die interconnect bridge)
and Foveros, technologies that allow multiple chips on a package to
be connected side by side (EMIB) or stacked on top of one another
in a 3D fashion (Foveros).The Disaggregated Manufacturing
Organization (DMO) develops fab processes for Foveros base silicon
interposer and embedded multi-die interconnect silicon bride (EMIB)
architectures to enable both internal and Foundry AP future
roadmaps.The DMO EMIB/Silicon Interposer TD Process Champion will
be the interface between the DMO TD Org and Process Module Teams in
Fab/Assembly to meet TD Program Deliverables.Responsibilities
include the following:- Collaborate across ATTD, LTD, ATTD, FEC,
and IFS orgs to develop fab processes that efficiently meet overall
AP Program needs through technology certifications.- Drive fab
process readiness (PRI) activities from concept through HVM ready
milestones including alignment of technology-enabling equipment
selections with target spec definition, technology cost roadmap
development, and manufacturability.- Understand interactions of fab
processing (ex: warpage, scribe layout) with various developing
assembly processes to enhance overall development cadence for
future roadmap offerings.- Coordinate resourcing across teams to
ensure milestones are on track to meet the development timelines of
several programs progressing in parallel.- Develop roadmaps to meet
new technology requirements across process modules.The ideal
candidate will exhibit the following behavioral traits:- Clear
communication across various organizations and levels.-
Demonstrated ability to drive cross-organizational teams to deliver
program deliverables.- Drive solutions to technology challenges as
they arise while maintaining delivery of overall program
deliverables.- Creativity and flexibility to address the emerging
challenges of AP through strong cross-team collaboration while
maintaining data-driven and constructive work environments.-
Develop a growing pipeline of individuals, managers, and teams to
continue to drive Intel's current and future AP
roadmaps.QualificationsMinimum QualificationsMasters in an
Engineering or Physics/EE/Chemistry/Material Science related
field.15+ years direct experience in process development or
integration of semiconductor devicesPreferred Qualifications:PhD in
an Engineering or Physics/EE/Chemistry/Material Science related
field.10+ years of experience in semiconductor process development
as a process engineer, process integrator or technical program
manager.-Prior experience as a Process Champion or Program
Manager-Prior Assembly (wafer/package) process development and/or
integration experience-Prior Fab process development and/or
integration experienceInside this Business GroupAs the world's
largest chip manufacturer, Intel strives to make every facet of
semiconductor manufacturing state-of-the-art -- from semiconductor
process development and manufacturing, through yield improvement to
packaging, final test and optimization, and world class Supply
Chain and facilities support. - Employees in the -Technology
Development and Manufacturing Group -are part of a worldwide
network of design, development, manufacturing, and assembly/test
facilities, all focused on utilizing the power of Moore's Law to
bring smart, connected devices to every person on Earth.Posting
StatementAll qualified applicants will receive consideration for
employment without regard to race, color, religion, religious
creed, sex, national origin, ancestry, age, physical or mental
disability, medical condition, genetic information, military and
veteran status, marital status, pregnancy, gender, gender
expression, gender identity, sexual orientation, or any other
characteristic protected by local law, regulation, or
ordinance.BenefitsWe offer a total compensation package that ranks
among the best in the industry. It consists of competitive pay,
stock, bonuses, as well as, benefit programs which include health,
retirement, and vacation. Find more information about all of our
Amazing Benefits Working ModelThis role will be eligible for our
hybrid work model which allows employees to split their time
between working on-site at their assigned Intel site and off-site.
In certain circumstances the work model may change to accommodate
business needs.Position of TrustThis role is a Position of Trust.
Should you accept this position, you must consent to and pass an
extended Background Investigation, which includes (subject to
country law), extended education, SEC sanctions, and additional
criminal and civil checks. For internals, this investigation may or
may not be completed prior to starting the position. For additional
questions, please contact your Recruiter.
Keywords: INTEL, Rio Rancho , EMIB Technology Development Process Champion, IT / Software / Systems , Albuquerque, New Mexico
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